Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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HYB3166165AT-40 | 4M x 16bit DRAM | Infineon-formely-Siemens | - | 50 | 0°C | 70°C | 284 K |
HYB3166165AT-50 | 4M x 16bit DRAM | Infineon-formely-Siemens | - | 50 | 0°C | 70°C | 284 K |
HYB5116165BJ-50 | 1M x 16bit EDO-DRAM | Infineon-formely-Siemens | - | 42 | 0°C | 70°C | 269 K |
HYB5116165BJ-60 | 1M x 16bit EDO-DRAM | Infineon-formely-Siemens | - | 42 | 0°C | 70°C | 269 K |
HYB5116165BJ-70 | 1M x 16bit EDO-DRAM | Infineon-formely-Siemens | - | 42 | 0°C | 70°C | 269 K |
LM6165J-MLS | High Speed Operational Amplifier | distributor | Cerdip | 8 | - | - | 460 K |
LM6165J-QMLV | High Speed Operational Amplifier | distributor | Cerdip | 8 | - | - | 460 K |
LM6165WG-QMLV | High Speed Operational Amplifier | distributor | Ceramic SOIC | 10 | - | - | 460 K |
LM6165WG-QMLV | High Speed Operational Amplifier | distributor | Ceramic SOIC | 10 | - | - | 460 K |
LM6165WG/883 | High Speed Operational Amplifier | distributor | Ceramic SOIC | 10 | - | - | 460 K |
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