Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
---|
HY57V641620HGLT-5 | 4 banks x 1M x 16Bit synchronous DRAM, 3.3V, LVTTL, low power, 200 MHz | distributor | TSOP II | 54 | 0°C | 70°C | 86 K |
HY57V641620HGLT-55 | 4 banks x 1M x 16Bit synchronous DRAM, 3.3V, LVTTL, low power, 183 MHz | distributor | TSOP II | 54 | 0°C | 70°C | 86 K |
HY57V641620HGT-8 | 4 banks x 1M x 16Bit synchronous DRAM, 3.3V, LVTTL, 125 MHz | distributor | TSOP II | 54 | 0°C | 70°C | 86 K |
HY57V641620HGT-H | 4 banks x 1M x 16Bit synchronous DRAM, 3.3V, LVTTL, 133 MHz | distributor | TSOP II | 54 | 0°C | 70°C | 86 K |
HY57V641620HGT-K | 4 banks x 1M x 16Bit synchronous DRAM, 3.3V, LVTTL, 133 MHz | distributor | TSOP II | 54 | 0°C | 70°C | 86 K |
HY57V641620HGT-S | 4 banks x 1M x 16Bit synchronous DRAM, 3.3V, LVTTL, 100 MHz | distributor | TSOP II | 54 | 0°C | 70°C | 86 K |
TC620HCOA | 5V, dual trip point temperature sensor. | TelCom-Semiconductor-Inc- | SOIC | 8 | 0°C | 70°C | 75 K |
TC620HCPA | 5V, dual trip point temperature sensor. | TelCom-Semiconductor-Inc- | Plastic DIP | 8 | 0°C | 70°C | 75 K |
TC620HEOA | 5V, dual trip point temperature sensor. | TelCom-Semiconductor-Inc- | SOIC | 8 | -40°C | 85°C | 75 K |
TC620HEPA | 5V, dual trip point temperature sensor. | TelCom-Semiconductor-Inc- | Plastic DIP | 8 | -40°C | 85°C | 75 K |
1 [2] [3] [4] |
---|