| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| 5962-87626012A | Hex D Flip-Flop with Master Reset | distributor | LCC | 20 | - | - | 140 K |
| 5962-8762601EA | Hex D Flip-Flop with Master Reset | distributor | Cerdip | 16 | - | - | 140 K |
| 5962-8762601FA | Hex D Flip-Flop with Master Reset | distributor | Cerpack | 16 | - | - | 140 K |
| LM6261M | High Speed Operational Amplifier | distributor | SOIC NARROW | 8 | - | - | 447 K |
| LM6261MX | High Speed Operational Amplifier | distributor | SOIC NARROW | 8 | - | - | 447 K |
| LM6261N | High Speed Operational Amplifier | distributor | MDIP | 8 | - | - | 447 K |
| LM6264N | High Speed Operational Amplifier | distributor | MDIP | 8 | - | - | 427 K |
| MH80626C | Battery feed/protection SIP. Applications: battery feed and secondary protection for off-premise SLICS | distributor | - | 20 | 0°C | 70°C | 29 K |
| MH89626C-02 | OPS/DID SLIC (subscriber line interface circuit) with 200 Om + 560 Om // 0.1 µF impedance. Applications: off premise digital PBX line cards, DID (direct inward dial) line cards and central office line cards. | distributor | - | 38 | 0°C | 70°C | 114 K |
| MH89626C-04 | OPS/DID SLIC (subscriber line interface circuit) with 200 Om + 680 Om // 0.1 µF impedance. Applications: off premise digital PBX line cards, DID (direct inward dial) line cards and central office line cards. | distributor | - | 38 | 0°C | 70°C | 114 K |
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