| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| IDT70825S20G | High-speed 8K x 16 sequential access random access memory | Integrated-Device-Technology-Inc- | PGA | 84 | 0°C | 70°C | 319 K |
| IDT70825S25G | High-speed 8K x 16 sequential access random access memory | Integrated-Device-Technology-Inc- | PGA | 84 | 0°C | 70°C | 319 K |
| IDT70825S35G | High-speed 8K x 16 sequential access random access memory | Integrated-Device-Technology-Inc- | PGA | 84 | 0°C | 70°C | 319 K |
| IDT70825S45G | High-speed 8K x 16 sequential access random access memory | Integrated-Device-Technology-Inc- | PGA | 84 | 0°C | 70°C | 319 K |
| MIC708M | µP Supervisory Circuits | distributor | SOIC | 8 | - | - | 177 K |
| MIC708N | µP Supervisory Circuits | distributor | PDIP | 8 | - | - | 177 K |
| MIC708RM | MIC708R/S/T µP Supervisory Circuits | distributor | SOIC | 8 | - | - | 185 K |
| MIC708SM | MIC708R/S/T µP Supervisory Circuits | distributor | SOIC | 8 | - | - | 185 K |
| MIC708TM | MIC708R/S/T µP Supervisory Circuits | distributor | SOIC | 8 | - | - | 185 K |
| SK70708HDX | 1168 kbps HDSL data pump chip set | Level-One-Communications | PLCC | 44 | -40°C | 85°C | 3 M |
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