| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| EP7309-CV-C | High-performance, low-power system on chip enchanced digital audio interface | Cirrus-Logic | PQFP | 208 | 0°C | 70°C | 1 M |
| EP7309-EV-C | High-performance, low-power system on chip enchanced digital audio interface | Cirrus-Logic | PQFP | 208 | 0°C | 70°C | 1 M |
| EP7309-IV-C | High-performance, low-power system on chip enchanced digital audio interface | Cirrus-Logic | PQFP | 208 | 0°C | 70°C | 1 M |
| PC87309-IBW/EB | SuperI/O Plug and Play Compatible Chip in Compact 100-Pin VLJ Packaging | distributor | - | - | - | - | 1 M |
| PC87309-IBW/VLJ | SuperI/O Plug and Play Compatible Chip in Compact 100-Pin VLJ Packaging | distributor | PQFP | 100 | - | - | 1 M |
| PC87309-ICK/EB | SuperI/O Plug and Play Compatible Chip in Compact 100-Pin VLJ Packaging | distributor | - | - | - | - | 1 M |
| PC87309-ICK/VLJ | SuperI/O Plug and Play Compatible Chip in Compact 100-Pin VLJ Packaging | distributor | PQFP | 100 | - | - | 1 M |
| S1C7309X01-E0R0 | B/W CCD processor | Samsung-Electronic | - | 48 | -20°C | 75°C | 621 K |
| TDA7309 | DIGITAL CONTROLLED STEREO AUDIO PROCESSOR WITH LOUDNESS | SGS-Thomson-Microelectronics | - | - | - | - | 128 K |
| TDA7309D | DIGITAL CONTROLLED STEREO AUDIO PROCESSOR WITH LOUDNESS | SGS-Thomson-Microelectronics | - | - | - | - | 128 K |
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