Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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73M223-CL | 1200 baud FSK modem | TDK-Semiconductor-Corporation | SOL | 16 | -25°C | 70°C | 60 K |
73M223-CP | 1200 baud FSK modem | TDK-Semiconductor-Corporation | PDIP | 16 | -25°C | 70°C | 60 K |
73M2910L | Microcontroller | TDK-Semiconductor-Corporation | QFP | 100 | - | - | 572 K |
73M2921-LG | Advanced single chip modem | TDK-Semiconductor-Corporation | QFP | 100 | -40°C | 85°C | 211 K |
M38073M2-XXXFP | RAM size: 512bytes; single-chip 8-bit CMOS microcomputer | Mitsubishi-Electric-Corporation-Semiconductor-Group | QFP | 80 | -20°C | 85°C | 1 M |
M38073M2-XXXFS | RAM size: 512bytes; single-chip 8-bit CMOS microcomputer | Mitsubishi-Electric-Corporation-Semiconductor-Group | LCC | 80 | -20°C | 85°C | 1 M |
M38B73M2H-XXXFP | RAM size: 512 bytes; single-chip 8-bit CMOS microcomputer | Mitsubishi-Electric-Corporation-Semiconductor-Group | QFP | 100 | -20°C | 85°C | 1 M |
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