Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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IDT7007L25G | High-speed 32K x 8 dual-port static RAM | Integrated-Device-Technology-Inc- | PGA | 68 | 0°C | 70°C | 258 K |
IDT7007L25GB | High-speed 32K x 8 dual-port static RAM | Integrated-Device-Technology-Inc- | PGA | 68 | -55°C | 125°C | 258 K |
IDT7007L25PF | High-speed 32K x 8 dual-port static RAM | Integrated-Device-Technology-Inc- | TQFP | 80 | 0°C | 70°C | 258 K |
IDT7007L25PFB | High-speed 32K x 8 dual-port static RAM | Integrated-Device-Technology-Inc- | TQFP | 80 | -55°C | 125°C | 258 K |
IDT70V07L25G | High-speed 3.3V 32K x 8 dual-port static RAM | Integrated-Device-Technology-Inc- | PGA | 68 | 0°C | 70°C | 246 K |
IDT70V07L25J | High-speed 3.3V 32K x 8 dual-port static RAM | Integrated-Device-Technology-Inc- | PLCC | 68 | 0°C | 70°C | 246 K |
IDT70V07L25PF | High-speed 3.3V 32K x 8 dual-port static RAM | Integrated-Device-Technology-Inc- | TQFP | 64 | 0°C | 70°C | 246 K |
IDT7187L25DB | CMOS static RAM 64K (64K x 1-bit) | Integrated-Device-Technology-Inc- | DIP | 22 | -55°C | 125°C | 70 K |
IDT7207L25J | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | PLCC | 32 | 0°C | 70°C | 148 K |
IDT7207L25J | CMOS asynchronous FIFO 32,768 x 9 | Integrated-Device-Technology-Inc- | PLCC | 32 | 0°C | 70°C | 148 K |
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