| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| CXP88152 | CMOS 8-bit Single Chip Microcomputer | Sony-Semiconductor | - | - | - | - | 482 K |
| GMS81524BK | HYUNDAI micro electronic, CMOS single-chip 8-bit microcontroller with A/D converter. ROM size 24K bytes, RAM size 448 bytes. Mask version. | distributor | SDIP | 64 | -20°C | 85°C | 1 M |
| GMS81524BLQ | HYUNDAI micro electronic, CMOS single-chip 8-bit microcontroller with A/D converter. ROM size 24K bytes, RAM size 448 bytes. Mask version. | distributor | LQFP | 64 | -20°C | 85°C | 1 M |
| GMS81524BQ | HYUNDAI micro electronic, CMOS single-chip 8-bit microcontroller with A/D converter. ROM size 24K bytes, RAM size 448 bytes. Mask version. | distributor | MQFP | 64 | -20°C | 85°C | 1 M |
| GMS81524BTK | HYUNDAI micro electronic, CMOS single-chip 8-bit microcontroller with A/D converter. ROM size 24K bytes OTP, RAM size 448 bytes. OTP version. | distributor | SDIP | 64 | -20°C | 85°C | 1 M |
| GMS81524BTQ | HYUNDAI micro electronic, CMOS single-chip 8-bit microcontroller with A/D converter. ROM size 24K bytes OTP, RAM size 448 bytes. OTP version. | distributor | MQFP | 64 | -20°C | 85°C | 1 M |
| UPC8152TA | Low-power silicon high-frequency amplifier ICs for cellular/cordless phones | NEC-Electronics-Inc- | - | - | - | - | 138 K |
| UPC8152TA-E3 | Low-power silicon high-frequency amplifier ICs for cellular/cordless phones | NEC-Electronics-Inc- | - | - | - | - | 138 K |
| UPC8152TB | Low-power silicon high-frequency amplifier ICs for cellular/cordless phones | NEC-Electronics-Inc- | - | - | - | - | 138 K |
| UPC8152TB-E3 | Low-power silicon high-frequency amplifier ICs for cellular/cordless phones | NEC-Electronics-Inc- | - | - | - | - | 138 K |
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