Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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5962H3829435BNA | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class Q. Lead finish solder. | distributor | FlatPack | 28 | -55°C | 125°C | 100 K |
5962H3829435BNA | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class Q. Lead finish solder. | distributor | FlatPack | 28 | -55°C | 125°C | 100 K |
5962H3829435BNC | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class Q. Lead finish gold. | distributor | FlatPack | 28 | -55°C | 125°C | 100 K |
5962H3829435BNX | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class Q. Lead finish optional. | distributor | FlatPack | 28 | -55°C | 125°C | 100 K |
5962H3829435BXA | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class Q. Lead finish solder. | distributor | DIP | 28 | -55°C | 125°C | 100 K |
5962H3829435BXC | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class Q. Lead finish gold. | distributor | DIP | 28 | -55°C | 125°C | 100 K |
5962H3829435BXX | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class Q. Lead finish optional. | distributor | DIP | 28 | -55°C | 125°C | 100 K |
5962H3829435SXA | Radiation-Hardened 8Kx8 SRAM: SMD. Total dose 1E6 rads(Si). 85ns access time. QML class V. Lead finish solder. | distributor | DIP | 28 | -55°C | 125°C | 100 K |
CXP82940 | CMOS 8-bit Single Chip Microcomputer | Sony-Semiconductor | - | - | - | - | 403 K |
CXP82948 | CMOS 8-bit Single Chip Microcomputer | Sony-Semiconductor | - | - | - | - | 403 K |
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