| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| AD7837AN | 0.3-17V; 1000mW; LC2MOS complete, dual 12-bit MDAC. For automatic test equipment, function generation, waveform reconstruction | Analog-Devices | DIP | 24 | -40°C | 85°C | 198 K |
| AD7837AQ | 0.3-17V; 1000mW; LC2MOS complete, dual 12-bit MDAC. For automatic test equipment, function generation, waveform reconstruction | Analog-Devices | CERDIP | 24 | -40°C | 85°C | 198 K |
| AD7837AR | 0.3-17V; 1000mW; LC2MOS complete, dual 12-bit MDAC. For automatic test equipment, function generation, waveform reconstruction | Analog-Devices | SOIC | 24 | -40°C | 85°C | 198 K |
| CH1837A | Data access arrangement module, V.34bis high speed DAA module | distributor | - | 5 | 0°C | 70°C | 202 K |
| MX7837AN | Complete, dual, 12-bit multiplying DAC. 8-bit + 4-bit interface. Error (LSB) +-1 | Maxim-Integrated-Producs | Narrow plastic DIP | 24 | -40°C | 85°C | 168 K |
| MX7837AQ | Complete, dual, 12-bit multiplying DAC. 8-bit + 4-bit interface. Error (LSB) +-1 | Maxim-Integrated-Producs | Narrow CERDIP | 24 | -40°C | 85°C | 168 K |
| MX7837AR | Complete, dual, 12-bit multiplying DAC. 8-bit + 4-bit interface. Error (LSB) +-1 | Maxim-Integrated-Producs | Wide SO | 24 | -40°C | 85°C | 168 K |
| PC837AB | 3-channel, high density mounting type photocoupler, CRT=80-260% | Sharp | DIP | 12 | -30°C | 100°C | 160 K |
| PC837AC | 3-channel, high density mounting type photocoupler, CRT=80-400% | Sharp | DIP | 12 | -30°C | 100°C | 160 K |
| PC837AD | 3-channel, high density mounting type photocoupler, CRT=80-600% | Sharp | DIP | 12 | -30°C | 100°C | 160 K |
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