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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
5962L0053601TUA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)).distributorCeramic flatpack36-55°C125°C128 K
5962L0053601TXA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)).distributorFlatpack shielded36-55°C125°C128 K
5962L0053602TUA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)).distributorCeramic flatpack36-40°C125°C128 K
5962L0053602TXA512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)).distributorFlatpack shielded36-40°C125°C128 K
5962L0053603TXA512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)).distributorFlatpack shielded36-55°C125°C128 K
5962L0151101QXC512K32 16Megabit SRAM MCM: SDM. 25ns access time, 5.0V operation. Lead finish gold. QML class Q. Total dose 5E4(50krad(Si)).distributorCQFP68-40°C125°C135 K
5962L9960703QUX512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class Q. Lead finish factory option. Total dose 5E4(50krad)(Si)distributorCeramic flatpack36-55°C125°C127 K
5962L9960703QUX512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class Q. Lead finish factory option. Total dose 5E4(50krad)(Si)distributorCeramic flatpack36-55°C125°C127 K
5962L9960704QUX512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class Q. Lead finish factory option. Total dose 5E4(50krad)(Si)distributorCeramic flatpack36-40°C125°C127 K
5962L9960704QUX512K x 8 SRAM: SMD. 20ns access time, 3.3V operation. Class Q. Lead finish factory option. Total dose 5E4(50krad)(Si)distributorCeramic flatpack36-40°C125°C127 K
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