| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| 5962H9653001VCA | RadHard MSI: SMD. Hex noninverting buffers. Class V, QML. Lead finish solder. Total dose 1E6 rads(Si). | distributor | Ceramic DIP | 14 | -55°C | 125°C | 10 M |
| 5962H9653001VXA | RadHard MSI: SMD. Hex noninverting buffers. Class V, QML. Lead finish solder. Total dose 1E6 rads(Si). | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 10 M |
| 5962H9653001VXA | RadHard MSI: SMD. Hex noninverting buffers. Class V, QML. Lead finish solder. Total dose 1E6 rads(Si). | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 10 M |
| 5962H9653001VXC | RadHard MSI: SMD. Hex noninverting buffers. Class V, QML. Lead finish gold. Total dose 1E6 rads(Si). | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 10 M |
| 5962H9653101VCA | RadHard MSI: SMD. Hex noninverting buffers. Class V, QML. Lead finish solder. Total dose 1E6 rads(Si). | distributor | Ceramic DIP | 14 | -55°C | 125°C | 10 M |
| 5962H9653101VCA | RadHard MSI: SMD. Hex noninverting buffers. Class V, QML. Lead finish solder. Total dose 1E6 rads(Si). | distributor | Ceramic DIP | 14 | -55°C | 125°C | 10 M |
| 5962H9653101VCX | RadHard MSI: SMD. Hex noninverting buffers. Class V, QML. Lead finish optional. Total dose 1E6 rads(Si). | distributor | Ceramic DIP | 14 | -55°C | 125°C | 10 M |
| 5962H9653101VXA | RadHard MSI: SMD. Hex noninverting buffers. Class V, QML. Lead finish solder. Total dose 1E6 rads(Si). | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 10 M |
| MB89653APF | 8-bit proprietary microcontroller | Fujitsu-Microelectronis | plastic QFP | 100 | -40°C | 85°C | 779 K |
| MB89653APFV | 8-bit proprietary microcontroller | Fujitsu-Microelectronis | plastic SQFP | 100 | -40°C | 85°C | 779 K |
| 1 [2] [3] [4] [5] [6] [7] [8] [9] [10] |
|---|
