| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| IDT6116LA120PB | CMOS static RAM 16K (2K x 8 bit) | Integrated-Device-Technology-Inc- | DIP | 24 | -55°C | 125°C | 91 K |
| IDT6116LA120TPB | CMOS static RAM 16K (2K x 8 bit) | Integrated-Device-Technology-Inc- | DIP | 24 | -55°C | 125°C | 91 K |
| IDT6116SA120PB | CMOS static RAM 16K (2K x 8 bit) | Integrated-Device-Technology-Inc- | DIP | 24 | -55°C | 125°C | 91 K |
| IDT6116SA120TPB | CMOS static RAM 16K (2K x 8 bit) | Integrated-Device-Technology-Inc- | DIP | 24 | -55°C | 125°C | 91 K |
| IDT7201LA120LB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | LCC | 32 | -55°C | 125°C | 152 K |
| IDT7201LA120SOB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | SOIC | 28 | -55°C | 125°C | 152 K |
| IDT7201LA120XE | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | CERPACK | 28 | 0°C | 70°C | 152 K |
| IDT7201LA120XEB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | CERPACK | 28 | -55°C | 125°C | 152 K |
| IDT7202LA120XE | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | CERPACK | 28 | 0°C | 70°C | 152 K |
| IDT7202LA120XEB | CMOS asynchronous FIFO 256 x 9, 512 x 9, 1K x 9 | Integrated-Device-Technology-Inc- | CERPACK | 28 | -55°C | 125°C | 152 K |
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