| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| AS6VA25616-BC | 2.7V to 3.3V 256K x 16 Intelliwatt low-power CMOS SRAM with one chip enable | Alliance-Semiconductor-Corporation | CSP BGA | 48 | 0°C | 70°C | 180 K |
| AS6VA25616-BC | 2.7V to 3.3V 256K x 16 Intelliwatt low-power CMOS SRAM with one chip enable | Alliance-Semiconductor-Corporation | CSP BGA | 48 | 0°C | 70°C | 180 K |
| AS6VA25616-BI | 2.7V to 3.3V 256K x 16 Intelliwatt low-power CMOS SRAM with one chip enable | Alliance-Semiconductor-Corporation | CSP BGA | 48 | -40°C | 85°C | 180 K |
| AS6VA25616-TC | 2.7V to 3.3V 256K x 16 Intelliwatt low-power CMOS SRAM with one chip enable | Alliance-Semiconductor-Corporation | TSOPII | 44 | 0°C | 70°C | 180 K |
| AS6VA25616-TI | 2.7V to 3.3V 256K x 16 Intelliwatt low-power CMOS SRAM with one chip enable | Alliance-Semiconductor-Corporation | TSOPII | 44 | -40°C | 85°C | 180 K |
| AS6WA25616-BC | 3.0V to 3.6V 256K x 16 Intelliwatt low-power CMOS SRAM with one chip enable | Alliance-Semiconductor-Corporation | CSP BGA | 48 | 0°C | 70°C | 180 K |
| AS6WA25616-TC | 3.0V to 3.6V 256K x 16 Intelliwatt low-power CMOS SRAM with one chip enable | Alliance-Semiconductor-Corporation | TSOPII | 44 | 0°C | 70°C | 180 K |
| AS6WA25616-TI | 3.0V to 3.6V 256K x 16 Intelliwatt low-power CMOS SRAM with one chip enable | Alliance-Semiconductor-Corporation | TSOPII | 44 | -40°C | 85°C | 180 K |
| OR3TP12-6BA256 | ORCA feild-programmable system chip embedded master/target PCI interface. 3.3 V. 32-bit, 33/66 MHz PCI bus interface. Array size 14 x 18. | distributor | PBGA | 256 | 0°C | 70°C | 2 M |
| OR3TP12-6BA256I | ORCA feild-programmable system chip embedded master/target PCI interface. 3.3 V. 32-bit, 33/66 MHz PCI bus interface. Array size 14 x 18. | distributor | PBGA | 256 | -40°C | 85°C | 2 M |
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