Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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ACS20MS | Radiation Hardened Dual 4-Input NAND Gate | Intersil-Corporation | - | - | - | - | 85 K |
UT54ACS20 | Radiation-hardened dual 4-input NAND gate. | distributor | DIP | 14 | -55°C | 125°C | 31 K |
UT54ACS20 | Radiation-hardened dual 4-input NAND gate. | distributor | FlatPack | 14 | -55°C | 125°C | 31 K |
UT54ACS20PCA | RadHard MSI. Dual 4-input NAND. CMOS compatible I/O level. Lead finish solder. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
UT54ACS20PCA | RadHard MSI. Dual 4-input NAND. CMOS compatible I/O level. Lead finish solder. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
UT54ACS20PCC | RadHard MSI. Dual 4-input NAND. CMOS compatible I/O level. Lead finish gold. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
UT54ACS20PCX | RadHard MSI. Dual 4-input NAND. CMOS compatible I/O level. Lead finish optional. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
UT54ACS20UCC | RadHard MSI. Dual 4-input NAND. CMOS compatible I/O level. Lead finish gold. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
UT54ACS20UCX | RadHard MSI. Dual 4-input NAND. CMOS compatible I/O level. Lead finish optional. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
UT54ACS20UCX | RadHard MSI. Dual 4-input NAND. CMOS compatible I/O level. Lead finish optional. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
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