| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| AT28HC256-12SC | 256 (32K x 8) high speed parallel EEPROM, 120ns | ATMEL-Corporation | SOIC | 28 | 0°C | 70°C | 445 K |
| AT28HC256-12SI | 256 (32K x 8) high speed parallel EEPROM, 120ns | ATMEL-Corporation | SOIC | 28 | -40°C | 85°C | 445 K |
| AT28HC256-90LM/883 | 256 (32K x 8) high speed parallel EEPROM, 90ns | ATMEL-Corporation | LCC | 32 | -55°C | 125°C | 445 K |
| AT28HC256E-12SC | 256 (32K x 8) high speed parallel EEPROM, 120ns | ATMEL-Corporation | SOIC | 28 | 0°C | 70°C | 445 K |
| AT28HC256E-12SI | 256 (32K x 8) high speed parallel EEPROM, 120ns | ATMEL-Corporation | SOIC | 28 | -40°C | 85°C | 445 K |
| AT28HC256E-90LM/883 | 256 (32K x 8) high speed parallel EEPROM, 90ns | ATMEL-Corporation | LCC | 32 | -55°C | 125°C | 445 K |
| AT28HC256F-12SC | 256 (32K x 8) high speed parallel EEPROM, 120ns | ATMEL-Corporation | SOIC | 28 | 0°C | 70°C | 445 K |
| AT28HC256F-12SI | 256 (32K x 8) high speed parallel EEPROM, 120ns | ATMEL-Corporation | SOIC | 28 | -40°C | 85°C | 445 K |
| AT28HC256F-90LM/883 | 256 (32K x 8) high speed parallel EEPROM, 90ns | ATMEL-Corporation | LCC | 32 | -55°C | 125°C | 445 K |
| AT28HC64B-12TI | 64K(8K x 8) high speed CMOS EEPROM with page write and software data protection | ATMEL-Corporation | TSOP | 28 | -40°C | 85°C | 661 K |
| << [4] [5] [6] [7] [8] 9 [10] |
|---|
