| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| ACT-F1M32B-100F14I | High speed 32 Megabit boot block FLASH multichip module. Speed 100ns. | distributor | CQFP | 68 | -40°C | 85°C | 149 K |
| ACT-F1M32B-100F14M | High speed 32 Megabit boot block FLASH multichip module. Speed 100ns. | distributor | CQFP | 68 | -55°C | 125°C | 149 K |
| ACT-F1M32B-100F14Q | High speed 32 Megabit boot block FLASH multichip module. Speed 100ns. | distributor | CQFP | 68 | -55°C | 125°C | 149 K |
| MH32D72AKLB-10 | 2415919104-bit synchronous DRAM module | Mitsubishi-Electric-Corporation-Semiconductor-Group | - | 184 | 0°C | 70°C | 358 K |
| MH32S64PHB-10 | 214683648-bit synchronous DRAM | Mitsubishi-Electric-Corporation-Semiconductor-Group | TSOP | 168 | 0°C | 70°C | 593 K |
| MH32S72PHB-10 | 2415919104-bit synchronous DRAM | Mitsubishi-Electric-Corporation-Semiconductor-Group | TSOP | 168 | 0°C | 70°C | 595 K |
| MH8S64PHB-10 | 1073741824-bit synchronous DRAM | Mitsubishi-Electric-Corporation-Semiconductor-Group | TSOP | 168 | 0°C | 70°C | 589 K |
| MH8S72PHB-10 | 1207959552-bit synchronous DRAM | Mitsubishi-Electric-Corporation-Semiconductor-Group | TSOP | 168 | 0°C | 70°C | 590 K |
| TB-10.0 | 10.0 KV High-energy triggered spark gap | distributor | - | 2 | - | - | 77 K |
| UPD71055GB-10 | 10 MHz parallel interface unit | NEC-Electronics-Inc- | PQFP | 44 | -40°C | 85°C | 486 K |
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