Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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K6T0808C1D-DB55 | 55ns, 32Kx8 bit low low power CMOS static RAM | Samsung-Electronic | DIP | 28 | 0°C | 70°C | 170 K |
K6T0808C1D-DB55 | 55ns, 32Kx8 bit low low power CMOS static RAM | Samsung-Electronic | DIP | 28 | 0°C | 70°C | 170 K |
K6T0808C1D-DB70 | 70ns, 32Kx8 bit low low power CMOS static RAM | Samsung-Electronic | DIP | 28 | 0°C | 70°C | 170 K |
K6T0808C1D-DL55 | 55ns, 32Kx8 bit low power CMOS static RAM | Samsung-Electronic | DIP | 28 | 0°C | 70°C | 170 K |
K6T0808C1D-DL70 | 70ns, 32Kx8 bit low power CMOS static RAM | Samsung-Electronic | DIP | 28 | 0°C | 70°C | 170 K |
K6T0808C1D-GB55 | 55ns, 32Kx8 bit low low power CMOS static RAM | Samsung-Electronic | SOP | 28 | 0°C | 70°C | 170 K |
K6T0808C1D-GL55 | 55ns, 32Kx8 bit low power CMOS static RAM | Samsung-Electronic | SOP | 28 | 0°C | 70°C | 170 K |
SCC2691AC1D24 | Universal asynchronous receiver/transmitter (UART) | Philips-Semiconductors | SOT137 | - | - | - | 168 K |
SVFC1D475M | Resign molded chip fuse built-in | NEC-Electronics-Inc- | - | - | - | - | 142 K |
SVHC1D685M | Resign molded chip high reliability | NEC-Electronics-Inc- | - | - | - | - | 104 K |
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