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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
M27C512-10C3TR512 Kbit (64Kb x 8) EPROM, 5V, 100nsSGS-Thomson-MicroelectronicsPLCC32-40°C125°C114 K
M27C512-10XC3TR512 Kbit (64Kb x 8) EPROM, 5V, 100nsSGS-Thomson-MicroelectronicsPLCC32-40°C125°C114 K
M27C512-12XC3TR512 Kbit (64Kb x 8) EPROM, 5V, 120nsSGS-Thomson-MicroelectronicsPLCC32-40°C125°C114 K
M27C512-15C3TR512 Kbit (64Kb x 8) EPROM, 5V, 150nsSGS-Thomson-MicroelectronicsPLCC32-40°C125°C114 K
M27C512-90C3TR512 Kbit (64Kb x 8) EPROM, 5V, 90nsSGS-Thomson-MicroelectronicsPLCC32-40°C125°C114 K
M27C512-90XC3TR512 Kbit (64Kb x 8) EPROM, 5V, 90nsSGS-Thomson-MicroelectronicsPLCC32-40°C125°C114 K
RD28F3204C3T7032-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 70nsIntel-CorporationBGA66-25°C85°C1 M
RD28F3204C3T7032-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 70nsIntel-CorporationBGA66-25°C85°C1 M
RD28F3208C3T9032-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 90nsIntel-CorporationBGA66-25°C85°C1 M
RD28F3208C3T9032-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family, 90nsIntel-CorporationBGA66-25°C85°C1 M
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