Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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MC80287 | 80-bit HMOS numeric processor extension | Intel-Corporation | Ceramic DIP | 40 | -55°C | 125°C | 399 K |
MOC8020 | 6-pin DIP optoisolators darlington output | Motorola | Standard thru hole | 6 | -55°C | 100°C | 271 K |
MOC8021 | 6-pin DIP optoisolators darlington output | Motorola | Standard thru hole | 6 | -55°C | 100°C | 271 K |
MSM27C802CZ | 524,288-word x 16-bit or 1,048,576-word x 8-bit one time PROM | distributor | DIP | 42 | 0°C | 70°C | 108 K |
MSM27C802CZ | 524,288-word x 16-bit or 1,048,576-word x 8-bit one time PROM | distributor | SOP | 44 | 0°C | 70°C | 108 K |
MSM27C802CZ | 524,288-word x 16-bit or 1,048,576-word x 8-bit one time PROM | distributor | TSOP | 44 | 0°C | 70°C | 108 K |
VSC8021FC | 2.5 Gb/s SONET-compatible 8-bit multiplexer chipset | distributor | LDCC | 52 | 0°C | 70°C | 212 K |
VSC8021FI | 2.5 Gb/s SONET-compatible 8-bit multiplexer chipset | distributor | LDCC | 52 | -40°C | 85°C | 212 K |
VSC8022FC | 2.5 Gb/s SONET-compatible 8-bit demultiplexer chipset | distributor | LDCC | 52 | 0°C | 70°C | 212 K |
VSC8022FI | 2.5 Gb/s SONET-compatible 8-bit demultiplexer chipset | distributor | LDCC | 52 | -40°C | 85°C | 212 K |
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