| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| A80960CA-16 | 32-bit high-performanc embedded processor 16MHz | Intel-Corporation | PGA | 168 | 0°C | 100°C | 977 K |
| KU80960CA-16 | 32-bit high-performanc embedded processor 16MHz | Intel-Corporation | PQFP | 196 | 0°C | 100°C | 977 K |
| S-2812ACA-150 | CMOS 16K-bit parallel E2PROM | Seiko-Epson-Corporation | Chip | - | -40°C | 85°C | -- |
| S-2817ACA-150 | CMOS 16K-bit parallel E2PROM | Seiko-Epson-Corporation | Chip | - | -40°C | 85°C | -- |
| S-2860BCA-150 | CMOS 16K-bit parallel E2PROM | Seiko-Epson-Corporation | Chip | - | -40°C | 85°C | 971 K |
| S-2864BCA-150 | CMOS 16K-bit parallel E2PROM | Seiko-Epson-Corporation | Chip | - | -40°C | 85°C | 971 K |
| SCA-1 | 0.3-3 GHz, cascadable GaAs MMIC amplifier | distributor | Low thermal resistan | 4 | -45°C | 85°C | 255 K |
| SCA-11 | 0.3-3 GHz, cascadable GaAs MMIC amplifier | distributor | Low thermal resistan | 4 | -45°C | 85°C | 273 K |
| SCA-12 | DC-4 GHz, cascadable GaAs HBT MMIC amplifier. High output IP3: 35 dBm @ 850M Hz | distributor | - | 4 | -40°C | 85°C | 540 K |
| TA80960CA-16 | 32-Bit high-performance embedded processor | Intel-Corporation | Ceramic PGA | 168 | -40°C | 110°C | 1 M |
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