| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| 2SD2211 | Power transistor | ROHM | - | 3 | - | - | 63 K |
| 2SD2212 | Medium power transistor | ROHM | - | 3 | - | - | 71 K |
| MB84VD2218XEC-90-PBS | Stacked MCP (multi-chip package) flash memory & SRAM 32M(x8/x16) flash memory & 4M(x8/x16) static RAM | Fujitsu-Microelectronis | plastic BGA | 73 | -25°C | 85°C | 1 M |
| MB84VD2218XEE-90-PBS | Stacked MCP (multi-chip package) flash memory & SRAM 32M(x8/x16) flash memory & 4M(x8/x16) static RAM | Fujitsu-Microelectronis | plastic BGA | 73 | -25°C | 85°C | 1 M |
| MB84VD2218XEG-90-PBS | Stacked MCP (multi-chip package) flash memory & SRAM 32M(x8/x16) flash memory & 4M(x8/x16) static RAM | Fujitsu-Microelectronis | plastic FBGA | 71 | -25°C | 85°C | 1 M |
| MB84VD2218XEH-90-PBS | Stacked MCP (multi-chip package) flash memory & SRAM 32M(x8/x16) flash memory & 4M(x8/x16) static RAM | Fujitsu-Microelectronis | plastic FBGA | 71 | -25°C | 85°C | 1 M |
| MB84VD2219XEC-90-PBS | Stacked MCP (multi-chip package) flash memory & SRAM 32M(x8/x16) flash memory & 4M(x8/x16) static RAM | Fujitsu-Microelectronis | plastic BGA | 73 | -25°C | 85°C | 1 M |
| MB84VD2219XEE-90-PBS | Stacked MCP (multi-chip package) flash memory & SRAM 32M(x8/x16) flash memory & 4M(x8/x16) static RAM | Fujitsu-Microelectronis | plastic BGA | 73 | -25°C | 85°C | 1 M |
| MCD221FU | CD-interface and audio processor | Motorola | QFP | 80 | 0°C | 70°C | 187 K |
| QED221 | Plastic Infrared Light Emitting Diode. 880 nm AlGaAs | distributor | - | - | - | - | 171 K |
| [1] [2] 3 [4] [5] [6] [7] [8] [9] [10] |
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