| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| GC509 | Class A amplifier with 3 independent gain blocks , 5V DC | Gennum-Corporation | Chip | - | -10°C | 40°C | 144 K |
| GC509 | Class A amplifier with 3 independent gain blocks , 5V DC | Gennum-Corporation | PLID | 10 | -10°C | 40°C | 144 K |
| GC509 | Class A amplifier with 3 independent gain blocks , 5V DC | Gennum-Corporation | MICROpac | 10 | -10°C | 40°C | 144 K |
| GC509 | Class A amplifier with 3 independent gain blocks , 5V DC | Gennum-Corporation | SLT | 10 | -10°C | 40°C | 144 K |
| GC514 | Dynamic equaliser chip | Gennum-Corporation | Chip | 17 | -10°C | 40°C | 73 K |
| GC562 | Telecoil preamplifier | Gennum-Corporation | Chip | 6 | -10°C | 40°C | 75 K |
| GC570 | DynamEQ II WDRC IC | Gennum-Corporation | Chip | 20 | -10°C | 40°C | 118 K |
| GC590 | Linear class H amplifier | Gennum-Corporation | Chip | 14 | -10°C | 40°C | 91 K |
| K4D263238A-GC50 | 128Mbit DDR SDRAM, SSTL_2 interface, 200MHz | Samsung-Electronic | FBGA | 144 | 0°C | 65°C | 298 K |
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