| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| INTEL82802AB | Firmware hub (FWH) | Intel-Corporation | TSOP | 40 | -10°C | 85°C | 471 K |
| INTEL82802AB | Firmware hub (FWH) | Intel-Corporation | PLCC | 32 | -10°C | 85°C | 471 K |
| INTEL82802AC | Firmware hub (FWH) | Intel-Corporation | TSOP | 40 | -10°C | 85°C | 471 K |
| INTEL82802AC | Firmware hub (FWH) | Intel-Corporation | PLCC | 32 | -10°C | 85°C | 471 K |
| QL8250-7PQ208C | Low power FPGA combining performance, density, embedded RAM. | distributor | PQFP | 208 | 0°C | 70°C | 739 K |
| QL8250-7PQ208I | Low power FPGA combining performance, density, embedded RAM. | distributor | PQFP | 208 | -40°C | 85°C | 739 K |
| QL8250-7PQ208M | Low power FPGA combining performance, density, embedded RAM. | distributor | PQFP | 208 | -55°C | 125°C | 739 K |
| QL8250-8PQ208C | Low power FPGA combining performance, density, embedded RAM. | distributor | PQFP | 208 | 0°C | 70°C | 739 K |
| QL8250-8PQ208I | Low power FPGA combining performance, density, embedded RAM. | distributor | PQFP | 208 | -40°C | 85°C | 739 K |
| QL8250-8PQ208M | Low power FPGA combining performance, density, embedded RAM. | distributor | PQFP | 208 | -55°C | 125°C | 739 K |
| << [3] [4] [5] [6] [7] 8 [9] [10] [11] [12] [13] >> |
|---|
