| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| 24LLC02N8 | 2K-bit serial EEPROM for low power. Operating voltage 1.8V to 5.5V, CMOS | distributor | PDIP | 8 | -40°C | 85°C | 658 K |
| 24LLC02S8 | 2K-bit serial EEPROM for low power. Operating voltage 1.8V to 5.5V, CMOS | distributor | SOP | 8 | -40°C | 85°C | 658 K |
| 24LLC02TS8 | 2K-bit serial EEPROM for low power. Operating voltage 1.8V to 5.5V, CMOS | distributor | TSSOP | 8 | -40°C | 85°C | 658 K |
| AS5C4009LLCW-100/IT | 512K x 8 SRAM - ultra low power | distributor | DIP | 32 | -40°C | 85°C | 148 K |
| AS5C4009LLCW-100/IT | 512K x 8 SRAM - ultra low power | distributor | DIP | 32 | -40°C | 85°C | 148 K |
| AS5C4009LLCW-85/IT | 512K x 8 SRAM - ultra low power | distributor | DIP | 32 | -40°C | 85°C | 148 K |
| LD-LLC-0001-050 | Serial ATA IP CORE | distributor | - | - | - | - | 124 K |
| ULLC0402FC05C | 5.0V; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards | distributor | - | - | -55°C | 150°C | 159 K |
| ULLC0402FC08C | 8.0V; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards | distributor | - | - | -55°C | 150°C | 159 K |
| ULLC0402FC3.3C | 3.3V; unbumped low capacitance flip chip array. For cellular phones, MCM boards, wireless communication circuit, IR LEDs, SMART & PCMCIA cards | distributor | - | - | -55°C | 150°C | 159 K |
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