Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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KM416C1004CJ-45 | 1M x 16Bit CMOS dynamic RAM with extended data out, 45ns, VCC=5.0V, refresh period=64ms | Samsung-Electronic | SOJ | 42 | 0°C | 70°C | 804 K |
KM416RD8AC-RK70 | 256K x 16 x 32s dependent banks direct RDRAM. Access time: 45 ns, speed: 711 Mbps(356 MHz). | Samsung-Electronic | microBGA(normal CSP) | 62 | 0°C | 70°C | 3 M |
KM416RD8AC-RK80 | 256K x 16 x 32s dependent banks direct RDRAM. Access time: 45 ns, speed: 800 Mbps(400 MHz). | Samsung-Electronic | microBGA(normal CSP) | 62 | 0°C | 70°C | 3 M |
KM416RD8AD-RK70 | 256K x 16 x 32s dependent banks direct RDRAM. Access time: 45 ns, speed: 711 Mbps(356 MHz). | Samsung-Electronic | microBGA(mirrored CS | 62 | 0°C | 70°C | 3 M |
KM416RD8AD-RK80 | 256K x 16 x 32s dependent banks direct RDRAM. Access time: 45 ns, speed: 800 Mbps(400 MHz). | Samsung-Electronic | microBGA(mirrored CS | 62 | 0°C | 70°C | 3 M |
KM416RD8AS-RM80 | 256K x 16 x 32s dependent banks for consumer package. Access time: 40 ns, speed: 800 Mbps(400 MHz). | Samsung-Electronic | microBGA | 54 | 0°C | 90°C | 3 M |
KM416RD8AS-SM80 | 256K x 16 x 32s dependent banks for consumer package. Access time: 40 ns, speed: 800 Mbps(400 MHz). | Samsung-Electronic | microBGA | 54 | 0°C | 90°C | 3 M |
ORLI10G-1BM416 | ORCA quad line 2.5 Gbits/s, 10 Gbits/s and 12.5 Gbits/s interface FPSC | distributor | PBGAM | 416 | -40°C | 85°C | 1 M |
ORLI10G-2BM416 | ORCA quad line 2.5 Gbits/s, 10 Gbits/s and 12.5 Gbits/s interface FPSC | distributor | PBGAM | 416 | -40°C | 85°C | 1 M |
ORLI10G-3BM416 | ORCA quad line 2.5 Gbits/s, 10 Gbits/s and 12.5 Gbits/s interface FPSC | distributor | PBGAM | 416 | -40°C | 85°C | 1 M |
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