| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| KS57P0408 | Single-chip CMOS microcontroller, OTP version | Samsung-Electronic | - | 44 | -40°C | 85°C | 427 K |
| KS57P0408 | Single-chip CMOS microcontroller, OTP version | Samsung-Electronic | - | 42 | -40°C | 85°C | 427 K |
| P0408FC05C | 5.0V; 200Watts; flip chip array. For cellular phones, MCM boards, wireless communication circuits, IR LEDs, SMART & PCMCIA cards | distributor | SOIC | 16 | -55°C | 150°C | 185 K |
| P0408FC08C | 8.0V; 200Watts; flip chip array. For cellular phones, MCM boards, wireless communication circuits, IR LEDs, SMART & PCMCIA cards | distributor | SOIC | 16 | -55°C | 150°C | 185 K |
| P0408FC12C | 12.0V; 200Watts; flip chip array. For cellular phones, MCM boards, wireless communication circuits, IR LEDs, SMART & PCMCIA cards | distributor | SOIC | 16 | -55°C | 150°C | 185 K |
| P0408FC24C | 24.0V; 200Watts; flip chip array. For cellular phones, MCM boards, wireless communication circuits, IR LEDs, SMART & PCMCIA cards | distributor | SOIC | 16 | -55°C | 150°C | 185 K |
| P0408FC3.3C | 3.3V; 200Watts; flip chip array. For cellular phones, MCM boards, wireless communication circuits, IR LEDs, SMART & PCMCIA cards | distributor | SOIC | 16 | -55°C | 150°C | 185 K |
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