Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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D2587P265 | Wavelength-selected, high-power with locker isolated DFB laser module. ITU-T frequency 192.65 THz. Center wavelength 1556.15 nm. High optical power 20 mW, CW | distributor | Metal/ceramic butter | 14 | -25°C | 70°C | 122 K |
EP2660-7R | Input voltage range:66-150V, output voltage 24V, DC/DC converter | distributor | SO | 32 | -25°C | 60°C | 72 K |
GP2660-7R | Input voltage range:21.6-50.4V, output voltage 24V, DC/DC converter | distributor | SO | 32 | -25°C | 60°C | 72 K |
OP265A | GaAs plastic infrared emitting diode | distributor | - | 2 | -40°C | 100°C | 382 K |
OP265B | GaAs plastic infrared emitting diode | distributor | - | 2 | -40°C | 100°C | 382 K |
OP265C | GaAs plastic infrared emitting diode | distributor | - | 2 | -40°C | 100°C | 382 K |
OR3LP26BA352C | ORCA feild-programmable system chip embedded master/target PCI interface. 32-/64-bit, 33/66 MHz PCI bus interface with 64-bit back-end data path in each direction. Array size 18 x 28. | distributor | PBGA | 352 | 0°C | 70°C | 5 M |
OR3LP26BA352I | ORCA feild-programmable system chip embedded master/target PCI interface. 32-/64-bit, 33/66 MHz PCI bus interface with 64-bit back-end data path in each direction. Array size 18 x 28. | distributor | PBGA | 352 | -40°C | 85°C | 5 M |
OR3LP26BM680C | ORCA feild-programmable system chip embedded master/target PCI interface. 32-/64-bit, 33/66 MHz PCI bus interface with 64-bit back-end data path in each direction. Array size 18 x 28. | distributor | PBGAM | 680 | 0°C | 70°C | 5 M |
OR3LP26BM680I | ORCA feild-programmable system chip embedded master/target PCI interface. 32-/64-bit, 33/66 MHz PCI bus interface with 64-bit back-end data path in each direction. Array size 18 x 28. | distributor | PBGAM | 680 | -40°C | 85°C | 5 M |
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