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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
D2587P265Wavelength-selected, high-power with locker isolated DFB laser module. ITU-T frequency 192.65 THz. Center wavelength 1556.15 nm. High optical power 20 mW, CWdistributorMetal/ceramic butter14-25°C70°C122 K
EP2660-7RInput voltage range:66-150V, output voltage 24V, DC/DC converterdistributorSO32-25°C60°C72 K
GP2660-7RInput voltage range:21.6-50.4V, output voltage 24V, DC/DC converterdistributorSO32-25°C60°C72 K
OP265AGaAs plastic infrared emitting diodedistributor-2-40°C100°C382 K
OP265BGaAs plastic infrared emitting diodedistributor-2-40°C100°C382 K
OP265CGaAs plastic infrared emitting diodedistributor-2-40°C100°C382 K
OR3LP26BA352CORCA feild-programmable system chip embedded master/target PCI interface. 32-/64-bit, 33/66 MHz PCI bus interface with 64-bit back-end data path in each direction. Array size 18 x 28.distributorPBGA3520°C70°C5 M
OR3LP26BA352IORCA feild-programmable system chip embedded master/target PCI interface. 32-/64-bit, 33/66 MHz PCI bus interface with 64-bit back-end data path in each direction. Array size 18 x 28.distributorPBGA352-40°C85°C5 M
OR3LP26BM680CORCA feild-programmable system chip embedded master/target PCI interface. 32-/64-bit, 33/66 MHz PCI bus interface with 64-bit back-end data path in each direction. Array size 18 x 28.distributorPBGAM6800°C70°C5 M
OR3LP26BM680IORCA feild-programmable system chip embedded master/target PCI interface. 32-/64-bit, 33/66 MHz PCI bus interface with 64-bit back-end data path in each direction. Array size 18 x 28.distributorPBGAM680-40°C85°C5 M
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