Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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K4E641612B-TC50 | 4M x 16bit CMOS dynamic RAM with extended data out, 3.3V power supply, 50ns | Samsung-Electronic | TSOP II | 50 | 0°C | 70°C | 885 K |
K4E641612C-TC50 | 4M x 16bit CMOS dynamic RAM with extended data out, 3.3V power supply, 50ns | Samsung-Electronic | TSOP II | 50 | 0°C | 70°C | 884 K |
K4E661612B-TC50 | 4M x 16bit CMOS dynamic RAM with extended data out, 3.3V power supply, 50ns | Samsung-Electronic | TSOP II | 50 | 0°C | 70°C | 885 K |
K4E661612C-TC50 | 4M x 16bit CMOS dynamic RAM with extended data out, 3.3V power supply, 50ns | Samsung-Electronic | TSOP II | 50 | 0°C | 70°C | 884 K |
K4S641632F-TC50 | CMOS SDRAM 4 x 1,048,576 words by 16 bits, max freq. 200MHz, LVTTL interface | Samsung-Electronic | TSOP II | 54 | 0°C | 70°C | 133 K |
K4S643232E-TC50 | 512K x 32bit x 4 banks synchronous DRAM LVTTL, 3.3V, 200MHz | Samsung-Electronic | TSOP II | 86 | 0°C | 70°C | 102 K |
K4S643232F-TC50 | 512K x 32bit x 4 banks synchronous DRAM LVTTL, 3.3V, 200MHz | Samsung-Electronic | TSOP II | 86 | 0°C | 70°C | 101 K |
TC500ACPE | Precision analog front end. | TelCom-Semiconductor-Inc- | Plastic DIP | 16 | 0°C | 70°C | 209 K |
TC500COE | Precision analog front end. | TelCom-Semiconductor-Inc- | SOIC | 16 | 0°C | 70°C | 209 K |
TC500CPE | Precision analog front end. | TelCom-Semiconductor-Inc- | Plastic DIP | 16 | 0°C | 70°C | 209 K |
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