| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| HGTD7N60C3S | TRANSISTOR IGBT | Fairchild-Semiconductor | - | - | - | - | 153 K |
| MBM29DL162TD70PBT | Flash memory CMOS 16M (2M x 8/1M x16) bit dual operation | Fujitsu-Microelectronis | plastic FBGA | 48 | -20°C | 70°C | 1 M |
| MBM29DL162TD70PFTR | Flash memory CMOS 16M (2M x 8/1M x16) bit dual operation | Fujitsu-Microelectronis | - | 48 | -20°C | 70°C | 1 M |
| MBM29DL163TD70PBT | Flash memory CMOS 16M (2M x 8/1M x16) bit dual operation | Fujitsu-Microelectronis | plastic FBGA | 48 | -20°C | 70°C | 1 M |
| MBM29DL163TD70PETN | Flash memory CMOS 16M (2M x 8/1M x16) bit dual operation | Fujitsu-Microelectronis | - | 48 | -20°C | 70°C | 1 M |
| MBM29DL163TD70PFTR | Flash memory CMOS 16M (2M x 8/1M x16) bit dual operation | Fujitsu-Microelectronis | - | 48 | -20°C | 70°C | 1 M |
| MBM29DL164TD70PBT | Flash memory CMOS 16M (2M x 8/1M x16) bit dual operation | Fujitsu-Microelectronis | plastic FBGA | 48 | -25°C | 70°C | 1 M |
| MBM29DL164TD70PFTR | Flash memory CMOS 16M (2M x 8/1M x16) bit dual operation | Fujitsu-Microelectronis | - | 48 | -20°C | 70°C | 1 M |
| RD28F1602C3TD70 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
| RD28F1604C3TD70 | 16-Mbit, 3 Volt advanced+boot block fflash memory (C3) stacked-chip scale package family,70ns | Intel-Corporation | BGA | 66 | -25°C | 85°C | 1 M |
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