Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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UT9Q512-20ICA | 512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish hot solder dipped. | distributor | Flatpack shielded | 36 | -55°C | 125°C | 128 K |
UT9Q512-20IWA | 512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish hot solder dipped. | distributor | Flatpack shielded | 36 | -40°C | 125°C | 128 K |
UT9Q512-20UCA | 512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish hot solder dipped. | distributor | Ceramic flatpack | 36 | -55°C | 125°C | 128 K |
UT9Q512-20UWA | 512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish hot solder dipped. | distributor | Ceramic flatpack | 36 | -40°C | 125°C | 128 K |
UT9Q512-ICA | 512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish hot solder dipped. | distributor | Flatpack shielded | 36 | -55°C | 125°C | 128 K |
UT9Q512-IWA | 512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish hot solder dipped. | distributor | Flatpack shielded | 36 | -40°C | 125°C | 128 K |
UT9Q512-UWA | 512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish hot solder dipped. | distributor | Ceramic flatpack | 36 | -40°C | 125°C | 128 K |
UT9Q512-UWA | 512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish hot solder dipped. | distributor | Ceramic flatpack | 36 | -40°C | 125°C | 128 K |
UT9Q512K32-SPC | 512K32 16Megabit SRAM MCM. 25ns access time, 5.0V operation. Lead finish gold. Prototype flow. | distributor | CQFP | 68 | - | - | 135 K |
UT9Q512K32-SPC | 512K32 16Megabit SRAM MCM. 25ns access time, 5.0V operation. Lead finish gold. Prototype flow. | distributor | CQFP | 68 | - | - | 135 K |
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