| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| AT17LV256-10JC | FPGA configuration EEPROM, 3.3V-devices | ATMEL-Corporation | PLCC | 20 | 0°C | 70°C | 149 K |
| AT17LV256-10JI | FPGA configuration EEPROM, 3.3V-devices | ATMEL-Corporation | PLCC | 20 | -40°C | 85°C | 149 K |
| AT17LV256-10PC | FPGA configuration EEPROM, 3.3V-devices | ATMEL-Corporation | PDIP | 8 | 0°C | 70°C | 149 K |
| AT17LV256-10PI | FPGA configuration EEPROM, 3.3V-devices | ATMEL-Corporation | PDIP | 8 | -40°C | 85°C | 149 K |
| AT17LV256-10SC | FPGA configuration EEPROM, 3.3V-devices | ATMEL-Corporation | SOIC | 20 | 0°C | 70°C | 149 K |
| AT17LV256-10SI | FPGA configuration EEPROM, 3.3V-devices | ATMEL-Corporation | SOIC | 20 | -40°C | 85°C | 149 K |
| AT27LV256A-70JC | 256K(32K x 8) low voltage OTP CMOS EPROM | ATMEL-Corporation | PLCC | 32 | 0°C | 70°C | 221 K |
| AT27LV256A-70RC | 256K(32K x 8) low voltage OTP CMOS EPROM | ATMEL-Corporation | SOIC | 28 | 0°C | 70°C | 221 K |
| AT28LV256-25SI | 256K(32K x 8) low voltage CMOS EEPROM | ATMEL-Corporation | SOIC | 28 | -40°C | 85°C | 602 K |
| AT28LV256-25TI | 256K(32K x 8) low voltage CMOS EEPROM | ATMEL-Corporation | TSOP | 28 | -40°C | 85°C | 602 K |
| [1] [2] [3] [4] [5] [6] 7 [8] [9] [10] |
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