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Electronic component:Description:Manuf.PackagePinsT°minT°maxDatasheet
MF31M1-LZCATXX1Mb, 8/16-bit data bus static RAM cardMitsubishi-Electric-Corporation-Semiconductor-Group-680°C70°C116 K
MF32M1-LZCATXX2Mb, 8/16-bit data bus static RAM cardMitsubishi-Electric-Corporation-Semiconductor-Group-680°C70°C116 K
MF34M1-LZCATXX4Mb, 8/16-bit data bus static RAM cardMitsubishi-Electric-Corporation-Semiconductor-Group-680°C70°C116 K
ZCA8HPS12AC/DC front end. Maximum power 650W. Output voltage 12.0V, current 54.2A. Package style hot swap. Standard airflow.distributor--0°C70°C166 K
ZCA8HPS12IAC/DC front end. Maximum power 650W. Output voltage 12.0V, current 54.2A. Package style hot swap. I2C function.distributor--0°C70°C166 K
ZCA8HPS12RAC/DC front end. Maximum power 650W. Output voltage 12.0V, current 54.2A. Package style hot swap. Reverse airflow.distributor--0°C70°C166 K
ZCA8HPS24AC/DC front end. Maximum power 700W. Output voltage 24.0V, current 29.2A. Package style hot swap. Standard airflow.distributor--0°C70°C166 K
ZCA8HPS24AC/DC front end. Maximum power 700W. Output voltage 24.0V, current 29.2A. Package style hot swap. Standard airflow.distributor--0°C70°C166 K
ZCA8HPS48AC/DC front end. Maximum power 800W. Output voltage 48.0V, current 16.7A. Package style hot swap. Standard airflow.distributor--0°C70°C166 K
ZCA8HPS48RAC/DC front end. Maximum power 800W. Output voltage 48.0V, current 16.7A. Package style hot swap. Reverse airflow.distributor--0°C70°C166 K
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