Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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A80960CF-25 | 32-bit high-performance superscalar embedded microprocessor | Intel-Corporation | Ceramic PGA | 168 | 0°C | 100°C | 1 M |
KU80960CF-25 | 32-bit high-performance superscalar embedded microprocessor | Intel-Corporation | PQFP | 196 | 0°C | 100°C | 1 M |
KU80960CF-25 | 32-bit high-performance superscalar embedded microprocessor | Intel-Corporation | PQFP | 196 | 0°C | 100°C | 1 M |
KU80960CF-25 | 32-bit high-performance superscalar embedded microprocessor | Intel-Corporation | PQFP | 196 | 0°C | 100°C | 1 M |
TA80960CF-25 | 32-Bit high-performance superscalar processor | Intel-Corporation | Ceramic PGA | 168 | -40°C | 110°C | 1 M |
W78C438CF-25 | 8-bit microcontroller | Winbond-Electronics | PQFP100 | 100 | 0°C | 70°C | 147 K |
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