| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| ACTS112MS | Radiation Hardened Dual J-K Flip-Flop | Intersil-Corporation | - | - | - | - | 237 K |
| HCTS112MS | Radiation Hardened Dual JK Flip-Flop | Intersil-Corporation | - | - | - | - | 180 K |
| HCTS11MS | Radiation Hardened Triple 3-Input AND Gate | Intersil-Corporation | - | - | - | - | 121 K |
| UT54ACTS11 | Radiation-hardened triple 3-input AND gate. | distributor | DIP | 14 | -55°C | 125°C | 30 K |
| UT54ACTS11PCA | RadHard MSI. Triple 3-input AND. TTL compatible I/O level. Lead finish solder. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
| UT54ACTS11PCA | RadHard MSI. Triple 3-input AND. TTL compatible I/O level. Lead finish solder. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
| UT54ACTS11PCX | RadHard MSI. Triple 3-input AND. TTL compatible I/O level. Lead finish optional. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
| UT54ACTS11PCX | RadHard MSI. Triple 3-input AND. TTL compatible I/O level. Lead finish optional. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
| UT54ACTS11UCA | RadHard MSI. Triple 3-input AND. TTL compatible I/O level. Lead finish solder. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
| UT54ACTS11UCX | RadHard MSI. Triple 3-input AND. TTL compatible I/O level. Lead finish optional. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
| UT54ACTS11UCX | RadHard MSI. Triple 3-input AND. TTL compatible I/O level. Lead finish optional. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
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