Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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EP7309-CB-C | High-performance, low-power system on chip enchanced digital audio interface | Cirrus-Logic | PBGA | 208 | 0°C | 70°C | 1 M |
EP7309-CR-C | High-performance, low-power system on chip enchanced digital audio interface | Cirrus-Logic | PBGA | 208 | 0°C | 70°C | 1 M |
EP7309-CV-C | High-performance, low-power system on chip enchanced digital audio interface | Cirrus-Logic | PQFP | 208 | 0°C | 70°C | 1 M |
EP7309-EB-C | High-performance, low-power system on chip enchanced digital audio interface | Cirrus-Logic | PBGA | 208 | 0°C | 70°C | 1 M |
EP7309-ER-C | High-performance, low-power system on chip enchanced digital audio interface | Cirrus-Logic | PBGA | 208 | 0°C | 70°C | 1 M |
EP7309-EV-C | High-performance, low-power system on chip enchanced digital audio interface | Cirrus-Logic | PQFP | 208 | 0°C | 70°C | 1 M |
EP7309-IB-C | High-performance, low-power system on chip enchanced digital audio interface | Cirrus-Logic | PBGA | 208 | 0°C | 70°C | 1 M |
EP7309-IR-C | High-performance, low-power system on chip enchanced digital audio interface | Cirrus-Logic | PBGA | 208 | 0°C | 70°C | 1 M |
EP7309-IV-C | High-performance, low-power system on chip enchanced digital audio interface | Cirrus-Logic | PQFP | 208 | 0°C | 70°C | 1 M |
EP7312-CV | High-performance, low-power system on chip with SDRAM and enchanced digital audio interface | Cirrus-Logic | PQFP | 208 | 0°C | 70°C | 2 M |
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