| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| SVSP0G225M | Resign molded chip ultra miniaturized | NEC-Electronics-Inc- | - | - | - | - | 124 K |
| XC5210-3BG225C | Field programmable gate array. | distributor | Plastic BGA | 225 | 0°C | 85°C | 598 K |
| XC5210-4BG225C | Field programmable gate array. | distributor | Plastic BGA | 225 | 0°C | 85°C | 598 K |
| XC5210-5BG225I | Field programmable gate array. | distributor | Plastic BGA | 225 | -40°C | 100°C | 598 K |
| XC5210-6BG225I | Field programmable gate array. | distributor | Plastic BGA | 225 | -40°C | 100°C | 598 K |
| XC5215-3BG225C | Field programmable gate array. | distributor | Plastic BGA | 225 | 0°C | 85°C | 598 K |
| XC5215-4BG225C | Field programmable gate array. | distributor | Plastic BGA | 225 | 0°C | 85°C | 598 K |
| XC5215-5BG225C | Field programmable gate array. | distributor | Plastic BGA | 225 | 0°C | 85°C | 598 K |
| XC5215-6BG225C | Field programmable gate array. | distributor | Plastic BGA | 225 | 0°C | 85°C | 598 K |
| XC5215-6BG225I | Field programmable gate array. | distributor | Plastic BGA | 225 | -40°C | 100°C | 598 K |
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