Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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EP7312-CB | High-performance, low-power system on chip with SDRAM and enchanced digital audio interface | Cirrus-Logic | PBGA | 256 | 0°C | 70°C | 2 M |
EP7312-CV | High-performance, low-power system on chip with SDRAM and enchanced digital audio interface | Cirrus-Logic | PQFP | 208 | 0°C | 70°C | 2 M |
EP7312-CV-90 | High-performance, low-power system on chip with SDRAM and enchanced digital audio interface | Cirrus-Logic | PQFP | 208 | 0°C | 70°C | 2 M |
EP7312-EB | High-performance, low-power system on chip with SDRAM and enchanced digital audio interface | Cirrus-Logic | PBGA | 256 | 0°C | 70°C | 2 M |
EP7312-EV | High-performance, low-power system on chip with SDRAM and enchanced digital audio interface | Cirrus-Logic | PQFP | 208 | 0°C | 70°C | 2 M |
EP7312-EV-90 | High-performance, low-power system on chip with SDRAM and enchanced digital audio interface | Cirrus-Logic | PQFP | 208 | 0°C | 70°C | 2 M |
EP7312-IB | High-performance, low-power system on chip with SDRAM and enchanced digital audio interface | Cirrus-Logic | PBGA | 256 | 0°C | 70°C | 2 M |
EP7312-IB | High-performance, low-power system on chip with SDRAM and enchanced digital audio interface | Cirrus-Logic | PBGA | 256 | 0°C | 70°C | 2 M |
EP7312-IV | High-performance, low-power system on chip with SDRAM and enchanced digital audio interface | Cirrus-Logic | PQFP | 208 | 0°C | 70°C | 2 M |
EP7312-IV-90 | High-performance, low-power system on chip with SDRAM and enchanced digital audio interface | Cirrus-Logic | PQFP | 208 | 0°C | 70°C | 2 M |
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