Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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XQ4010E-3CB196M | QPRO QML high-reliability FPGA. | distributor | Top brazed ceramic Q | 196 | -55°C | 125°C | 304 K |
XQ4010E-3HQ208N | QPRO QML high-reliability FPGA. | distributor | Plastic QFP | 208 | -55°C | 125°C | 304 K |
XQ4010E-4CB196M | QPRO QML high-reliability FPGA. | distributor | Top brazed ceramic Q | 196 | -55°C | 125°C | 304 K |
XQ4010E-4HQ208N | QPRO QML high-reliability FPGA. | distributor | Plastic QFP | 208 | -55°C | 125°C | 304 K |
XQ4013E-3CB228M | QPRO QML high-reliability FPGA. | distributor | Top brazed ceramic Q | 228 | -55°C | 125°C | 304 K |
XQ4013E-3HQ240N | QPRO QML high-reliability FPGA. | distributor | Plastic QFP | 240 | -55°C | 125°C | 304 K |
XQ4013E-3PG223M | QPRO QML high-reliability FPGA. | distributor | Ceramic PGA | 223 | -55°C | 125°C | 304 K |
XQ4013E-4CB228M | QPRO QML high-reliability FPGA. | distributor | Top brazed ceramic Q | 228 | -55°C | 125°C | 304 K |
XQ4013E-4HQ240N | QPRO QML high-reliability FPGA. | distributor | Plastic QFP | 240 | -55°C | 125°C | 304 K |
XQ4013E-4PG223M | QPRO QML high-reliability FPGA. | distributor | Ceramic PGA | 223 | -55°C | 125°C | 304 K |
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