| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| SP310ECA | High-performance RS-232 line drivers/receivers | Sipex-Corporation | SSOP | 20 | 0°C | 70°C | 172 K |
| SP310ECP | High-performance RS-232 line drivers/receivers | Sipex-Corporation | PDIP | 18 | 0°C | 70°C | 172 K |
| SP310ECT | High-performance RS-232 line drivers/receivers | Sipex-Corporation | SOIC | 18 | 0°C | 70°C | 172 K |
| SP310EEP | High-performance RS-232 line drivers/receivers | Sipex-Corporation | PDIP | 18 | -40°C | 85°C | 172 K |
| SP310EET | High-performance RS-232 line drivers/receivers | Sipex-Corporation | SOIC | 18 | -40°C | 85°C | 172 K |
| TISP3135H3SL | Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection | Power-Innovations | SL | - | - | - | 231 K |
| TISP3145H3SL | Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection | Power-Innovations | SL | - | - | - | 231 K |
| TISP3180 | Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection | Power-Innovations | - | - | - | - | 195 K |
| TISP3180H3SL | Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection | Power-Innovations | SL | - | - | - | 231 K |
| TISP3180L | Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection | Power-Innovations | - | - | - | - | 112 K |
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