| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| UT54ACS10PCA | RadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish solder. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
| UT54ACS10PCC | RadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish gold. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
| UT54ACS10PCC | RadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish gold. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
| UT54ACS10PCX | RadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish optional. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
| UT54ACS10UCA | RadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish solder. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
| UT54ACS10UCA | RadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish solder. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
| UT54ACS10UCC | RadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish gold. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
| UT54ACS10UCC | RadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish gold. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
| UT54ACS10UCX | RadHard MSI. Triple 3-input NAND. CMOS compatible I/O level. Lead finish optional. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
| UT54ACS11PCA | RadHard MSI. Triple 3-input AND. CMOS compatible I/O level. Lead finish solder. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
| UT54ACS11PCC | RadHard MSI. Triple 3-input AND. CMOS compatible I/O level. Lead finish gold. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
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