Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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LMX2301TM | PLLatinum 160 MHz Frequency Synthesizer for RF Personal Communications | distributor | TSSOP | 20 | - | - | 225 K |
LMX2301TMX | PLLatinum 160 MHz Frequency Synthesizer for RF Personal Communications | distributor | TSSOP | 20 | - | - | 225 K |
LMX2305TM | PLLatinum Frequency Synthesizer for RF Personal Communications | distributor | TSSOP | 20 | - | - | 228 K |
LMX2305WG-MLS | PLLatinum Frequency Synthesizer for RF Personal Communications | distributor | Ceramic SOIC | 20 | - | - | 228 K |
LMX2305WG-MLS | PLLatinum Frequency Synthesizer for RF Personal Communications | distributor | Ceramic SOIC | 20 | - | - | 228 K |
LMX2305WG-MPR | PLLatinum Frequency Synthesizer for RF Personal Communications | distributor | Ceramic SOIC | 20 | - | - | 228 K |
LMX2306MWC | 550 MHz PLLatinum Low Power Frequency Synthesizer for RF Personal Communications | distributor | - | - | - | - | 300 K |
LMX2306TM | 550 MHz PLLatinum Low Power Frequency Synthesizer for RF Personal Communications | distributor | TSSOP | 16 | - | - | 300 K |
LMX2306TM | 550 MHz PLLatinum Low Power Frequency Synthesizer for RF Personal Communications | distributor | TSSOP | 16 | - | - | 300 K |
MPX2300DT1 | Chip pak high volume pressure sensor | Motorola | ISSUE B | 4 | 15°C | 40°C | 74 K |
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