| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| ACTS541MS | Radiation Hardened Octal Three-State Buffer/Line Driver | Intersil-Corporation | - | - | - | - | 66 K |
| ACTS541T | Radiation Hardened Octal Three-State Buffer/Line Driver | Intersil-Corporation | - | - | - | - | 57 K |
| UT54ACTS541 | Radiation-hardened octal bufer & line driver, three-state outputs. | distributor | DIP | 20 | -55°C | 125°C | 37 K |
| UT54ACTS541 | Radiation-hardened octal bufer & line driver, three-state outputs. | distributor | FlatPack | 20 | -55°C | 125°C | 37 K |
| UT54ACTS541PCA | RadHard MSI. Octal buffer & line driver with 3-state outputs. TTL compatible I/O level. Lead finish solder. | distributor | Ceramic DIP | 20 | -55°C | 125°C | 15 K |
| UT54ACTS541PCX | RadHard MSI. Octal buffer & line driver with 3-state outputs. TTL compatible I/O level. Lead finish optional. | distributor | Ceramic DIP | 20 | -55°C | 125°C | 15 K |
| UT54ACTS541UCA | RadHard MSI. Octal buffer & line driver with 3-state outputs. TTL compatible I/O level. Lead finish solder. | distributor | Ceramic flatpack | 20 | -55°C | 125°C | 15 K |
| UT54ACTS541UCA | RadHard MSI. Octal buffer & line driver with 3-state outputs. TTL compatible I/O level. Lead finish solder. | distributor | Ceramic flatpack | 20 | -55°C | 125°C | 15 K |
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