| Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
|---|
| ACTS10MS | Radiation Hardened Triple Three-Input NAND Gate | Intersil-Corporation | - | - | - | - | 112 K |
| UT54ACTS10 | Radiation-hardened quadruple 3-input NAND gate. | distributor | FlatPack | 14 | -55°C | 125°C | 32 K |
| UT54ACTS10 | Radiation-hardened quadruple 3-input NAND gate. | distributor | DIP | 14 | -55°C | 125°C | 32 K |
| UT54ACTS10 | Radiation-hardened quadruple 3-input NAND gate. | distributor | DIP | 14 | -55°C | 125°C | 32 K |
| UT54ACTS109 | Radiation-hardened dual J-K flip-flop. | distributor | DIP | 16 | -55°C | 125°C | 52 K |
| UT54ACTS109 | Radiation-hardened dual J-K flip-flop. | distributor | FlatPack | 16 | -55°C | 125°C | 52 K |
| UT54ACTS10PCA | RadHard MSI. Triple 3-input NAND. TTL compatible I/O level. Lead finish solder. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
| UT54ACTS10PCA | RadHard MSI. Triple 3-input NAND. TTL compatible I/O level. Lead finish solder. | distributor | Ceramic DIP | 14 | -55°C | 125°C | 15 K |
| UT54ACTS10UCC | RadHard MSI. Triple 3-input NAND. TTL compatible I/O level. Lead finish gold. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
| UT54ACTS10UCC | RadHard MSI. Triple 3-input NAND. TTL compatible I/O level. Lead finish gold. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
| UT54ACTS10UCX | RadHard MSI. Triple 3-input NAND. TTL compatible I/O level. Lead finish optional. | distributor | Ceramic flatpack | 14 | -55°C | 125°C | 15 K |
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