Electronic component: | Description: | Manuf. | Package | Pins | T°min | T°max | Datasheet |
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HCTS365MS | Radiation Hardened Hex Buffer/Line Driver Non-Inverting | Intersil-Corporation | - | - | - | - | 200 K |
UT54ACTS365 | Radiation-hardened hex buffer/line driver with three-state outputs. | distributor | DIP | 16 | -55°C | 125°C | 39 K |
UT54ACTS365PCA | RadHard MSI. Hex buffer/line driver with 3-state outputs. TTL compatible I/O level. Lead finish solder. | distributor | Ceramic DIP | 16 | -55°C | 125°C | 15 K |
UT54ACTS365PCC | RadHard MSI. Hex buffer/line driver with 3-state outputs. TTL compatible I/O level. Lead finish gold. | distributor | Ceramic DIP | 16 | -55°C | 125°C | 15 K |
UT54ACTS365PCX | RadHard MSI. Hex buffer/line driver with 3-state outputs. TTL compatible I/O level. Lead finish optional. | distributor | Ceramic DIP | 16 | -55°C | 125°C | 15 K |
UT54ACTS365UCA | RadHard MSI. Hex buffer/line driver with 3-state outputs. TTL compatible I/O level. Lead finish solder. | distributor | Ceramic flatpack | 16 | -55°C | 125°C | 15 K |
UT54ACTS365UCC | RadHard MSI. Hex buffer/line driver with 3-state outputs. TTL compatible I/O level. Lead finish gold. | distributor | Ceramic flatpack | 16 | -55°C | 125°C | 15 K |
UT54ACTS365UCX | RadHard MSI. Hex buffer/line driver with 3-state outputs. TTL compatible I/O level. Lead finish optional. | distributor | Ceramic flatpack | 16 | -55°C | 125°C | 15 K |
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